2024 April Special Issue: Packaging at Nanoscale
- “The Editors’ Desk [The Editors’ Desk]”
Bing Sheu, Chang Gung University, Taiwan;
Shao-Ku Kao, Chang Gung University, Taiwan.
- “Packaging at Nanoscale Will Advance Future Heterogeneous System Integration [Guest Editorial]”
Markondeya Raj Pulugurtha, Florida International University, USA;
Attila Bonyár, Budapest University of Technology and Economics, Hungary.
- “An Introduction to Nanomaterials for Nanopackaging”
James E. Morris, Portland State University, USA.
- “Nanopackaging for FutureG Solutions”
Ghaleb Saleh Ghaleb Al-Duhni, Florida International University, USA;
Muhammad Mahmudul Hasan, Florida International University, USA;
Nezih Pala, Florida International University, USA;
Markondeya Raj Pulugurtha, Florida International University, USA.
- “Nanopackaging Chiplets for AI and HPC Applications”
Siddharth Ravichandran, Chiplet, USA.
- “Integrated Micro-Capacitors and Micro-Inductors for Next Generation Electronics”
G. Ezhilarasu, University of California, Los Angeles, USA;
S. S. Iyer, University of California, Los Angeles, USA.
- “A Review on hybrid Bonding Interconnection and Its Characterization”
Chien-Kang Hsiung, National Yang Ming Chiao Tung University, Taiwan;
Kuan-Neng Chen, National Yang Ming Chiao Tung University, Taiwan.